Real Concern to High Speed VLSI Design for Interconnect Scaling
نویسندگان
چکیده
منابع مشابه
Interconnect Synthesis in High Speed Digital VLSI Routing
The advent of the nanotechnology has introduced new challenges and non-conventional problems to high speed digital Very Large Scale Integrated (VLSI) design. Moreover, the resultant progress of manufacturing technology is widening the gap between current Computer Aided Design (CAD) tools and VLSI technologies. This is reflected clearly in the IC design process where the Integrated Circuit (IC) ...
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متن کاملHigh Speed CMOS VLSI Design Lecture 4 : Interconnect RC ( c ) 1997
Once upon a time, the delay of a circuit was well approximated as the sum of the delays of the gates. Wires could be viewed as equipotential nodes that instantly carried the voltage to all ends. As transistors have shrunk, the relative delay of gates has decreased. At the same time, the delay of wires per unit length has actually increased. Thus, wires now are a very important part of total delay.
متن کاملInterconnect design with VLSI CMOS
Historically, high-performance logic circuit interchip design has focused on bipolar emitter-coupled logic (ECL) circuits and signals, but VLSl CMOS has attained performance levels at which problems unique to its characteristics must be addressed for design optimization. In this paper, CMOS interchip circuit models are applied to develop packaging and wiring constraints for synchronous communic...
متن کاملHigh Speed CMOS VLSI Design Lecture 5 : Interconnect LRC ( c ) 1997
As feature size continues to scale, transistors get progressively faster. Interconnect, however, slows down because smaller wires packed more densely have higher resistance and capacitance. Thus, wire delay accounts for a significant and growing portion of overall path delay on many modern circuits. Understanding how such delays will scale with advances in process technology is important when c...
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ژورنال
عنوان ژورنال: JOURNAL OF MECHANICS OF CONTINUA AND MATHEMATICAL SCIENCES
سال: 2019
ISSN: 0973-8975,2454-7190
DOI: 10.26782/jmcms.spl.2019.08.00055